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A-WBP-O002EG-11TB01

Part number A-WBP-O002EG-11TB01
Product classification Headers, Male Pins
Manufacturer ASSMANN WSW Components
Description WIRE-TO-BOARD, WAFER, 3.00MM, 11
Encapsulation
Packing Bag
Quantity 0
RoHS status YES
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Total number

Quantity

Price

Total price

2000

$1.0290

$2,058.0000

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Product parameters
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TYPEDESCRIPTION
MfrASSMANN WSW Components
SeriesA-WBP
PackageBag
Product StatusACTIVE
FeaturesBoard Guide
Connector TypeHeader
Voltage Rating250VAC
Current Rating (Amps)5A
Mounting TypeThrough Hole
Number of Positions11
Number of Rows1
StyleBoard to Board
Operating Temperature-25°C ~ 85°C
Contact TypeMale Pin
Fastening TypeLocking Ramp
Number of Positions LoadedAll
TerminationKinked Pin, Solder
Material Flammability RatingUL94 V-0
Contact MaterialBrass
Insulation ColorBlack
Pitch - Mating0.118" (3.00mm)
Contact Finish - MatingTin
Contact ShapeSquare
Contact Length - Post0.126" (3.20mm)
Insulation Height0.390" (9.91mm)
ShroudingShrouded - 4 Wall
Insulation MaterialLiquid Crystal Polymer (LCP)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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