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XCVM1502-2LSEVFVC1760

Part number XCVM1502-2LSEVFVC1760
Product classification System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC VERSALPRIME ACAP FPGA 1760BGA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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$10,448.8125

$10,448.8125

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Product parameters
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TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ Prime
PackageTray
Product StatusACTIVE
Package / Case1760-BFBGA, FCBGA
Speed450MHz, 1.08GHz
RAM Size256KB
Operating Temperature0°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA

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Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
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CONN HEADER VERT 2POS
Sullins Connector Solutions
CONN HEADER R/A 2POS
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